Connection method, connection structure, insulating adhesive member, electronic component having adhesive member, and method for manufacturing same

摘要: Provided are a connection method capable of achieving high conduction reliability and reliability, structure which is configured by being connected using the method. In an insulating adhesive film (20), first layer (21) that contains filler (21b) in composition (21a), second (22) no (22a) laminated. The following equation satisfied: H/2 < Tf H ≤ Tf+Tn, where height bump IC chip (10) H, thickness Tf, Tn. A surface substrate electrode formed (12) to each other through (20) electronic component arranged oppose other, other.