A method of mounting a plurality of electronic parts on a circuit board
作者： Koide Jyunichi , Tsukagoshi Isao , Kobayashi Kouji , Fukushima Naoki , Matsuda Kazuya
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摘要: An apparatus includes a connection sheet having separator layer and an adhesive film formed on the such that said can be peeled from layer. The cohesive strength of decreases when is heated to predetermined temperature. Electronic parts each have electrode surface at least one surface. electronic affixed coats all exposed portions surfaces
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