Circuit connecting material and semiconductor device manufacturing method using same
作者： Hironobu Moriyama
DOI:
关键词:
摘要: Provided are a circuit connecting material able to provide good bonding with an opposing electrode, and semiconductor device manufacturing method using the same. The present invention uses material, in which first adhesive layer be adhered chip side, second having lowest melting viscosity attainment temperature higher than that of laminated. When on is stuck mounted board, thickness within range satisfying formula (1), thereby providing electrode.
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