Semiconductor flip-chip package and method for the fabrication thereof

摘要: A simplified process for flip-chip attachment of a chip (10) to substrate (20) is provided by pre-coating the with an encapsulant underfill material (22) having discrete solder columns therein eliminate conventional capillary flow process. Such structure permits incorporation remeltable layers rework, test, or repair. It also allows electrical redistribution layers. In one aspect, and pre-coated are placed at angle brought into contact substrate, then pivoted about first point contact, expelling any gas therebetween until bumps (14) on fully in (20). There configuration compliant solder/flexible understructure that deforms generally laterally as undergoes expansion contraction. With this configuration, absorbs strain caused without bending