Process and substrate for connecting an integrated circuit to another substrate by means of balls
作者： Gerard Dehaine , Yves Stricot
DOI:
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摘要: An integrated circuit (IC) package (10), having an (11) and a connecting substrate (12) comprising insulating film (13), one side of which carries conductors (14) the other balls (15) connected to respective by means via holes (16) in film. The are fixed directly said holes, base is formed conductors. preferably made remeltable material such as tin lead fixation can be initially adhesive substance. process for two substrates (12, 22) (15), comprises provided with (16), consists fixing remelting balls. soldered or prefixed substance pads (23) board (22).
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