Packaging multi-chip modules without wire-bond interconnection

摘要: Described is a novel packaging of MCM tiles without wire-bond interconnections and in total thickness which reduced relative to conventional The tile includes substrate with plurality peripheral metallizations at least one chip flip-chip mounted on the substrate. PWB provided an aperture smaller than size silicon but larger outside dimensions chips. positioned so that its ends overlap areas adjacent chips fit into aperture. Peripheral are interconnected by either solder reflow technology or conductive adhesive technology.