Tape with solder forms for semiconductor devices

摘要: An electronic component with insulative tape-held solder forms is disclosed. Electronic components may be any of the integrated circuit chips, chip packages and printed boards. The are coupled to conductive pads through through-holes in tape. shaped as balls, cylinders, polygonal boxes, barrels, or hour-glasses. tape thermally heat resistant. made an organic material such elastomer. further have impregnated materials ceramic, aluminum nitride, flux improve its thermal, mechanical, and/or electrical properties.