System and Method for Cleaning Semiconductor Fabrication Equipment Parts

摘要: A process for cleaning semiconductor fabrication equipment parts includes determining a definition clean part including multiple maximum acceptable impurity levels; an initial levels of prior to its cleaning; apply the part; applying part, wherein creates reduced below that comparing against impurities definition; and repeating application if do not meet part. dilute aqueous solution 0.5-1.5%wt. HF; 0.1-0.5%wt. HNO3; 1-10%wt. H2O2. method reducing sub-surface damage how deep is beneath surface chemically etching said stopping chemical at about depth damage.