The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing

摘要: A micro-tensile testing for studying the cyclic fatigue mechanical properties of freestanding copper thin film with thickness sub-micrometer application MEMS was performed to observe its response under tension-tension experiments a variety mean stress conditions at loading frequencies up 20 Hz. Tensile sample applied using piezoelectric actuator. Loads were measured capacitance gap sensor coupling sample. The carried out feedback give load control on sputter deposited 300, 500 and 900 nm films. Loading cycles failure reached over 10^6 low trend decreasing increasing as anticipated. results provided clear evidence creep rate dependent change in mechanism from crack formation extended plasticity is decreased.