Fatigue in thin films: lifetime and damage formation

作者: O Kraft , R Schwaiger , P Wellner

DOI: 10.1016/S0921-5093(01)00990-X

关键词: Thin filmTensile testingDeposition (law)CantileverNanoindentationComposite numberForensic engineeringSubstrate (electronics)Materials scienceComposite materialPolyimide

摘要: … mechanisms in constrained volumes and to determine fatigue lifetimes under … the fatigue behavior of thin metal films on substrates: The first technique involves tensile testing of Cu films …

参考文章(14)
S. Suresh, Fatigue of materials ,(1991)
D READ, Tension-tension fatigue of copper thin films☆ International Journal of Fatigue. ,vol. 20, pp. 203- 209 ,(1998) , 10.1016/S0142-1123(97)00080-7
Ramnath Venkatraman, John C. Bravman, Separation of film thickness and grain boundary strengthening effects in Al thin films on Si Journal of Materials Research. ,vol. 7, pp. 2040- 2048 ,(1992) , 10.1557/JMR.1992.2040
Sanki Hong, Rolf Weil, Low cycle fatigue of thin copper foils Thin Solid Films. ,vol. 283, pp. 175- 181 ,(1996) , 10.1016/0040-6090(95)08225-5
Shefford P. Baker, William D. Nix, MECHANICAL PROPERTIES OF COMPOSITIONALLY MODULATED AU-NI THIN FILMS : NANOINDENTATION AND MICROCANTILEVER DEFLECTION EXPERIMENTS Journal of Materials Research. ,vol. 9, pp. 3131- 3144 ,(1994) , 10.1557/JMR.1994.3131
H. D. Merchant, M. G. Minor, Y. L. Liu, Mechanical fatigue of thin copper foil Journal of Electronic Materials. ,vol. 28, pp. 998- 1007 ,(1999) , 10.1007/S11664-999-0176-X
R-M. Keller, S. P. Baker, E. Arzt, Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation Journal of Materials Research. ,vol. 13, pp. 1307- 1317 ,(1998) , 10.1557/JMR.1998.0186
William D. Nix, Mechanical properties of thin films Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 20, pp. 2217- 2245 ,(1989) , 10.1007/BF02666659