Semiconductor chip with insulating frame - including heat sink and conductive structure

摘要: A novel semiconductor chip has (i) an insulating frame (10) with a top face recess (11) and window opening (12) which extends vertically through the lower part of into recess; (ii) metal or alloy heat sink (20) inserted in attached to frame; (iii) conductive structure (13,14,15) from bottom predetermined region on either upper (iv) device (30) sink; (v) wiring (40) bonded, at one end and, other end, region. ADVANTAGE - Heat is rapidly conducted away so that may have high power device. The its are well protected simple mfr.