No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

摘要: Methods and apparatus for improved thermal performance electromagnetic interference (EMI) shielding in integrated circuit (IC) packages are described. A die-up or die-down package includes an IC die, a die attach pad, heat spreader cap coupled to the pad defining cavity, one more peripheral rows of leads surrounding pad. The do not protrude substantially from footprint encasing structure. defines structure that encloses shields EMI emanating radiating towards die. also dissipates generated by during operation.