Ball grid array package having leads

摘要: A ball grid array having leads is provided, which comprises a die, leads, heatsink, conductive wires, solder balls, substrate, and packaging material. The substrate are stacked on the so that disposed between one face of die-mounting area heatsink exposed. die has lower surface contacted with for being mounted an upper connected to wires. electrically via printed circuit board leads. balls other substrate. material encapsulates wires prevent from damaged.