SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要: PROBLEM TO BE SOLVED: To improve electrical characteristics of a semiconductor device. SOLUTION: A device is provided with tape substrate 4, where plural leads 4c which are electrically connected to the electrode pads 1b chip 1 in response arranged an opening part 4e and bump lands 4f, 4c, installed bumps via inner wirings 4d. lead 4a capacity increase permitting electrodes 4h for ground, power source or specified signals extend outside plating 4b, group respective at tip side insulated/separated by individual after electrolytic processing 4. In executing processing, fed all leading 4b.