Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application.

作者: Zhong Zhao , Liqun Du , Yousheng Tao , Qingfeng Li , Lei Luo

DOI: 10.1016/J.ULTSONCH.2016.04.021

关键词: Ultrasonic sensorMicroelectromechanical systemsSubstrate (electronics)Compressive strengthComposite materialMaterials scienceOverpotentialPolarization (electrochemistry)NanotechnologyElectroformingLayer (electronics)

摘要: Micro electroforming is widely used for fabricating micro metal devices in Electro Mechanism System (MEMS). However, there the problem of poor adhesion strength between layer and substrate. This dramatically influences dimensional accuracy device. To solve this problem, ultrasonic agitation method applied during process. explore effect on strength, experiments were carried out under different power (0W, 100W, 150W, 200W, 250W) frequencies (0kHz, 40kHz, 80kHz, 120kHz, 200kHz). The effects frequency process investigated by polarization alternating current (a.c.) impedance method. substrate was measured scratch test. compressive stress X-ray Diffraction (XRD) crystallite size Transmission Electron Microscopy (TEM) internal contact surface area cyclic voltammetry (CV) experimental results indicate that can decrease overpotential increase charge transfer Generally, increased reduced. And then enhanced. Due to depolarization frequency, strengthening are different. When 200W best. In order prove which improve devices, pillar arrays fabricated (200W, 40kHz). show residual rate about 17% work contributes with large strength.

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