Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate

摘要: Micro electroforming is an important technology, which widely used for fabricating micro metal devices in MEMS. The have the problem of poor adhesion strength, has dramatically influenced dimensional accuracy and seriously limited development technology. In order to improve ultrasonic agitation method applied during process this paper. To explore effect agitation, experiments were carried out under ultrasonic-free conditions. effects on investigated by polarization alternating current (a.c.) impedance methods. real surface area layer was measured cyclic voltammetry method. compressive stress crystallite size X-ray Diffraction (XRD) strength scratch test. experimental results show that imposition decreases overpotential increases charge transfer at electrode-electrolyte interface process. area, reduces stress. Then improved about 47% average. addition, mechanisms improving are originally explored size, lower is, larger is. Furthermore, enhances mechanical interlocking consequently strength. This work contributes with large