Control of the adhesion strength between nickel replica and copper mold by electrochemical nucleation of lead

摘要: The failure to release nickel replica from its copper mold occurs sometimes, in particular, when is thin, large and has microstructures such as micro prism arrays. induced by improper adhesion strength between mold. When the becomes too strong, of can lead poor surface finish or severe damages on and/or mold; weak, premature happen due internal stress that been built up during electrochemical deposition, leading electroforming process. To address this challenge, paper proposes a simple effective approach control strength. electrochemically deposit certain density nuclei before depositing nickel. Our experiments indicate that: (1) be conveniently controlled nucleation duration time electrical current; (2) affects significantly hence used strength; (3) easy associated roughness improved an optimal deposited