Printed circuit board with aligned connections and method of making same
作者： Christina M. Boyko , Richard W. Carpenter , Joseph G. Sabia , Francis J. Bucek , Darleen Mayo
DOI:
关键词: Dielectric 、 Chip 、 Optoelectronics 、 Electrical engineering 、 Printed circuit board 、 Materials science 、 Footprint (electronics) 、 Integrated circuit 、 Substrate (printing) 、 Electrical connection 、 Photoresist
摘要: The present invention provides an improved circuit board for mounting integrated chips and a technique manufacturing the board. permits direct chip attachment to by providing necessary geometry footprint pattern of connections without necessity multi-level packaging using carriers. includes substrate with plated through holes, film photoresist dielectric material disposed on substrate. is photo patterned form vias which are then filled conductive material. Electrical connection pads formed exposed surface in be mounted thereon. holes arranged groups patterns provide some between wired
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