Method of manufacturing multi-layer printed circuit board
作者： Yogo Kawasaki , Yutaka Iwata , Hiroaki Satake , Tetsuya Tanabe
DOI:
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摘要: Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50 , via 66 right on the through respectively. Due this, arranged linearly, thereby making it possible shorten wiring length accelerate signal transmission speed. Also, since be connected solder bumps 76 (conductive connection pins 78 ), respectively, directly one another, excellent reliability in is ensured.
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