Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler

摘要: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance cool-heat shock without forming unevenness on the surface lowering peel strength even if thickness of resin insulating layer thin. The invention proposes comprising an upper conductor layer, lower electrically both layers, in which composite comprised made from heat-resistant hardly soluble acid or oxidizing agent as adhesive for electroless plating necessary, filled concave portion created between circuits so render into same plane circuit.