Insulating resin composition for build-up by copper foil lamination and method for production of multilayer printed circuit board using the composition

摘要: An insulating resin composition for the build-up of multilayer circuits by procedure copper foil lamination and a method production printed circuit board use are disclosed. The comprises at least one species epoxy having softening point not more than 110° C., monomer or an oligomer possessing unsaturated double bond, curing agent, photopolymerization initiator. is applied to throughout entire area thereof so as cover conductor patterns formed thereon then irradiated with UV light. Subsequently superposed on layer means heated pressure roller effect thereof. thermally cured give laminate outer produced selectively etched form prescribed pattern.