Multi-layered interconnect structure using liquid crystalline polymer dielectric
作者： Mark D. Poliks , Douglas O. Powell , Frank D. Egitto , Voya R. Markovich , Donald S. Farquhar
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摘要: A multi-layered interconnect structure and method of formation. In a first embodiment, second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to opposing surface thermally conductive layer, with no extrinsic adhesive material bonding the layer either or LCP layer. 2S1P substructures surfaces joining substructures.
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