Electronic System Thermal Design for Reliability

摘要: Thermal design and analysis are important in Reliability/Availability/Maintainability R/A/M programs for electronic systems. A thermal approach emphasizing the coupling of heat transfer theory experiment to basic reliability considerations is illustrated here by discussing typical problems on several system integration levels a high reliability, multi-cabinet hybrid computer system. This paper emphasizes particular attitude toward aspects equipment design, one that flexible methods analysis, comprehensive its treatment each level complementary fashion, oriented goals program as whole. The examples show conventional analytic solutions, when coupled with modicum experimental results, lead effective design.