Exact thermal representation of multilayer rectangular structures by infinite plate structures using the method of images
作者： Arthur L. Palisoc , Chin C. Lee
DOI: 10.1063/1.341975
关键词:
摘要: Using the method of images and analytical temperature solution to multilayer infinite plate structure, thermal profile over finite rectangular integrated circuit devices can be calculated exactly. The advantage using image lies in enhanced capability arriving at an for structures where solutions do not apparently exist, e.g., circular or arbitrarily oriented sources multilayered structures. new approach results large savings computer CPU time especially small substrates. also finds very important applications with heat dissipating elements close edge boundaries. Results from two examples indicate that boundaries a device may utilized remove it. This additional removing should have high power devices.
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