Integrated-circuit thermal modeling
作者： R. Castello , P. Antognetti
DOI: 10.1109/JSSC.1978.1051054
关键词:
摘要: The static heat-flow problem has been solved analytically in three dimensions for a two-blocks structure. computer program calculating the temperature maps is simple and fast. Examples are given of profiles on chip surface high-power IC.
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sci-hub.se 参考文章(7)
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