Thermal analysis of multiple-layer structures
作者： A.G. Kokkas
关键词: Semiconductor 、 AC power 、 Materials science 、 Thermal insulation 、 Electrical engineering 、 Thermal conductivity 、 Thermal analysis 、 Optoelectronics 、 Electronic circuit 、 Transient response 、 Integrated circuit
摘要: The response of temperature to dc and steady-state ac power inputs in multiple-layer rectangular structures has been derived by solving analytically the problem heat flow three dimensions. Attention is focused on electrothermal integrated circuit (IC) substrates consisting a semiconductor, thermal conductor, insulator. analysis applies as well single-layer systems, such conventional IC substrates, for which transient also found.
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