Thermal Model for MCM’s
作者： Francesc Masana
DOI: 10.1007/978-1-4615-5651-0_10
关键词: Adiabatic process 、 Materials science 、 Mechanics 、 Boundary value problem 、 Thermal resistance 、 Steady state (electronics) 、 Thermal model 、 Spreading resistance profiling 、 Isothermal process 、 Thermal coupling
摘要: A model based on closed form expressions for steady state thermal resistance evaluation of chips and their coupling, under adiabatic isothermal boundary conditions, is presented.
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sci-hub.st 参考文章(4)
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