Development of a thermal resistance model for chip-on-board packaging of high power LED arrays
作者： Minseok Ha , Samuel Graham
DOI: 10.1016/J.MICROREL.2012.02.005
关键词:
摘要: … An analytical thermal resistance model is presented for the LED array and validated by comparing it with finite element analysis (FEA) results. By using the analytical expression of …
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sci-hub.se 参考文章(19)
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