摘要: A detailed analysis of the heat flow in a light-emitting diode is carried out present paper. In thermal model diode, from active region throughout area between it and top contact, nonuniform flux density distribution due to current-spreading effect as well temperature dependence conductivity semiconductor material, are taken into account. The solutions conduction equation for obtained both steady-state condition transient-state condition. heat-spreading heat-sink analyzed. LED construction parameters on its resistance illustrated numerous figures.
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