Thermocompression bonding module and method of using the same
作者： Peter Borisuk , John Steckler , Edward Ethen , Vincent Levannier
DOI:
关键词: Haptic technology 、 Thermocompression bonding 、 Structural engineering 、 Engineering 、 Mechanical engineering
摘要: A thermocompression bonding module includes a thermode assembly configured to be mounted plate member. The heater apply force an item during operation and control device coupled the for adjusting applied by item. feedback is positioned, relative in order detect assembly. adjusts based on detected device.
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