Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
作者： Kenichi Nishino , Naoto Hosotani , Shozo Minamitani , Syunji Onobori , Koichi Morita
DOI:
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摘要: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, provided. The post-bonds the component by contact member (1211) having device (122). By executing pre-bonding post-bonding of independently each other, time required for post-boding can be reduced, compared conventional case, productivity whole mounting line improved.
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