Quick-loading soldering apparatus
作者： Alexander James Ciniglio
DOI:
关键词:
摘要: A quick-loading soldering apparatus for PCBs comprises a rotatable deck which has plurality of angularly spaced PCB work sites. While first site is positioned pre-loading and pre-heating components at station, second pre-loaded station. Correct rotation the ensured by sensor mounted on deck. If angle correct, locator pins provided externally become actionable an operator to register prior being soldered.
lens.org 参考文章(50)
Jeffry Alan Davis, Paul Zachary Wirth, Method and apparatus for thermally processing microelectronic workpieces ,(2006)
Phillip A. Ragard, Roy M. Whiting, Michael D. Snyder, Automated hybrid circuit board assembly apparatus ,(1977)
Gerald R. Dunn, Kenneth N. Abel, Method of removing a soldered integrated circuit package from a printed circuit board ,(1984)
Marco Bianchi, Assembly platform for an equipping of printed circuit boards ,(1987)
Yatsuharu Yokota, Automatic reflow soldering apparatus ,(1997)
Robert C Ingraham, Method for manufacturing alloyed junction semiconductor devices ,(1957)
Richard G Rauch, Helmut E Durr, Apparatus for securing a plurality of conductors to components ,(1965)
Takehiko Murakami, Reflow apparatus in continuous printing and mounting apparatus for film-like printing body ,(2002)
Charles W. Genson, Method of and apparatus for applying solder to metallic blanks ,(1978)
Kenichi Nishino, Naoto Hosotani, Shozo Minamitani, Syunji Onobori, Koichi Morita, Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components ,(1998)