Lead frame and manufacturing method thereof
作者： Yoshimoto Ryouichi
DOI:
关键词: Semiconductor package 、 Materials science 、 Connection (principal bundle) 、 Layer (electronics) 、 Semiconductor device 、 Plating 、 Thin film 、 Terminal (electronics) 、 Optoelectronics 、 Lead frame
摘要: The present invention provides a lead frame capable of allowing the surface terminal for connection to be different from external connection, and manufacturing method thereof. (50, 51) is made metal plate, wherein at least part its backside exposed as terminals semiconductor device mounted on surface. Therefore, can treated component mount type package. A plating layer (30) being bonded formed side, thin film (40) attached backside.
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