Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions
作者： A.A. El-Daly , A.E. Hammad , A. Fawzy , D. A. Nasrallh
DOI: 10.1016/J.MATDES.2012.06.058
关键词: Microstructure 、 Materials science 、 Deformation (engineering) 、 Creep 、 Metallurgy 、 Solid solution strengthening 、 Soldering 、 Volume fraction 、 Eutectic system 、 Dislocation
摘要: Minor alloying addition to solders has been an important strategy to improve the integrity and reliability of Pb-free solders joint. In this study, the effects of 0.06 Ni and 0.5 Sb additives on the microstructure and solidification behavior as well as the creep properties of Sn–1.0 Ag–0.5 Cu (SAC105) alloys were investigated. Results show that alloying of Ni and Sb resulted in considerably reduced undercooling, increased eutectic area and extended volume fraction of proeutectic Sn of which the dendritic size was refined. Moreover, with the …
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