The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy
作者： M.H. Mahdavifard , M.F.M. Sabri , D.A. Shnawah , S.M. Said , I.A. Badruddin
DOI: 10.1016/J.MICROREL.2015.06.134
关键词: Bismuth 、 Scanning electron microscope 、 Melting point 、 Supercooling 、 Precipitation hardening 、 Materials science 、 Ultimate tensile strength 、 Soldering 、 Ductility 、 Metallurgy
摘要: Abstract This work investigates the effect of Fe and Bi addition, 0.05 wt.% 1 wt.% or 2 wt.% Bi, on microstructural, mechanical, thermal properties low silver Sn–1Ag–0.5Cu (SAC105) solder alloy. Adding to SAC105 increased ultimate tensile strength (UTS) yield decreased total elongation which is related solid-solution precipitation strengthening effects by in Sn-rich phase. While made few FeSn2 bulk does not have considerable mechanical properties. Scanning electron microscopy (FESEM) energy dispersive X-ray (EDX) showed that strengthen scattering SAC105-Fe alloy, thereby β-Sn degenerated Cu6Sn5 Ag3Sn into a chain-like arrangement. Surface fracture SAC–Fe–Bi alloys brittle because prevented deform therefore its ductility. Finally, significantly reduces melting point undercooling.
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