Preparation of Property-Controlled Bi-Based Solder Powders by a Ball-Milling Process
作者： Sang Kim , Min Son , Van Nguyen , Tae-Soo Lim , Dong-Yeol Yang
DOI: 10.3390/MET6040074
关键词: Melting point 、 Composite material 、 Metallurgy 、 Ball mill 、 Solid solution 、 Ternary operation 、 Solder paste 、 Polyethylene terephthalate 、 Soldering 、 Fabrication 、 Materials science
摘要: Three kinds of Bi-based solder powders with different chemical compositions binary Bi–Sn, ternary Bi–Sn–In, and quaternary Bi–Sn–In–Ga were prepared using a gas atomization process subsequently ball-milled for smaller-size fabrication. In particular, only the severely broken to size less than 10 μm in polyhedral shape due presence constitutional element, degree overall oxidation, formation solid solution, which had affected fractured extent Ga-containing powders. Furthermore, melting point also decreased by addition and/or Ga into Bi–Sn system, resulting 60.3 °C Thus, it was possible that appropriate adhesion more compact bump arrays, enabling reflowing at low temperature 110 on flexible polyethylene terephthalate (PET) substrate.
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