A Modular Solder System with Hierarchical Morphology and Backward Compatibility.
作者： Han Bit Lee , Young Won Kim , Sang Hoon Kim , Suk Hee Park , Joon-Phil Choi
关键词:
摘要: A modular solder system with hierarchical morphology and micro/nanofeatures in which nanoparticles are distributed on the surface of template micropowders is reported. core-shell structure subsidiary nanostructures, improved intended properties also presented. In addition, polymer additives can be used not only as an adhesive (like epoxy resin) but to impart other functions. By combining all these, it determined that able increase reflowability a heat-sensitive plastic substrate, oxidation resistance, electrical conductivity. this respect, could readily modified by changing composition each constituent adopting backward compatibility knowledge information attained from previously designed offer feedback toward further improving newly one. practice, In-Sn-Bi engineered Sn-Zn result pronounced reflowing flexible Au-coated polyethylene terephthalate (PET) substrate even at low temperature 110 °C. Depending their respective concentrations, incorporation CuO@CeO2 nanostructures poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) polymers increases resistance conductivity solder.
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