Low Temperature Sintering Cu6Sn5 Nanoparticles for Superplastic and Super‐uniform High Temperature Circuit Interconnections

作者: Ying Zhong , Rong An , Chunqing Wang , Zhen Zheng , Zhi-Quan Liu

DOI: 10.1002/SMLL.201500896

关键词: SuperplasticityMaterials scienceFoundation (engineering)MetallurgyNanoparticleEducation developmentSintering

摘要: National Natural Science Foundation of China [51374084]; Iwama Endowed Fund at UC San Diego; Power Electronics and Education Development Program Delta Environmental & Educational

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