Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder

摘要: A hexagonal-rod growth mechanism is proposed to describe the behavior of primary Cu6Sn5 phase in liquid Sn-based solder. After Sn-6.5 at.%Cu solder had been maintained at 250°C for 10 h, a large number hexagonal-rod-type grains were found have separated within it. Our observations show that these hexagonal rods side facets \(\{ 10\overline{1} 0\}_{\mathrm{\eta} }\) family and round ends close {0002}η family. Moreover, nucleation was studied, corresponding kinetics be governed by Cu-supply-controlled rather than an interfacial-reaction-controlled or Cu-diffusion-limited mechanism. More importantly, anisotropic confirmed dominant reason production with high aspect ratio. This may represent avenue synthesis nanosized single crystals use as anode materials lithium-ion batteries. Additionally, our provide insight into morphological kinetic studies on interfacial similar intermetallics.