Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni
作者： JW Xian , MAA Mohd Salleh , SA Belyakov , TC Su , G Zeng
DOI: 10.1016/J.INTERMET.2018.08.002
关键词:
摘要: Abstract The influence of Ni on the size and twinning primary Cu6Sn5 crystals in Sn-0.7Cu-0.05Ni Sn-xCu (x = 0.7, 0.9, 1.1) (mass%) solder joints is studied using synchrotron radiography SEM-based EBSD. It shown that addition does not cause significant refinement if alloy fully melted. However, for peak temperatures ≤250 °C relevant to industrial soldering, are completely melted there 10–100 times more numerous smaller than Sn-0.7Cu. X-shaped with an angle ∼70° commonly formed Sn-0.7Cu-0.05Ni/Cu be penetration twins. This type growth was only found partially samples, both binary Sn-1.1Cu alloy. frequency twinned significantly higher Ni-containing solders. results discussed terms liquidus slope lattice parameters (Cu,Ni)6Sn5.
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