作者: Hideyuki Yasuda , Kazuhiro Nogita , Stuart D. McDonald , Syo Matsumura , Christopher M. Gourlay
DOI: 10.1016/J.JALLCOM.2021.159031
关键词:
摘要: Abstract The intermetallic Cu6Sn5 is ubiquitous in electronic interconnects where research has focused on controlling the size and distribution of this phase for improved performance. also finds application as an anode material advanced lithium-ion batteries. anodes can be fabricated via in-situ growth method involving reaction between molten Sn Cu current collector. This manufacturing route offers some advantages over traditional fabrication however process slow, limiting its practical application. In work we show addition 6 wt% Ni to collector greatly accelerates (Cu,Ni)6Sn5 Cu-xNi/Sn solid-melt couples, leading a rate up 50x faster, reducing processing time above 200 °C less than 10 min. studies dynamics formation Cu-xNi alloys liquid through real-time observation using synchrotron X-ray imaging. are characterised, kinetics analysed. Subsequently, mechanism accelerated investigated with electron backscatter diffraction transmission microscopy. results due η-(Cu,Ni)6Sn5 grains two distinct concentration ranges, finer spalling, which turn facilitates diffusion Sn, enhancing kinetics.