Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures
作者： C. Wieser , W. Hügel , S. Martin , J. Freudenberger , A. Leineweber
DOI: 10.1007/S11664-020-08036-7
关键词:
摘要: A current issue in electrical engineering is the enhancement of quality solder joints. This mainly associated with ongoing electrification transportation as well miniaturization (power) electronics. For reliability joints, intermetallic phases microstructure are great importance. The formation Cu-Sn system was investigated for different annealing temperatures between 472 K and 623 K using pure Cu Cu-1at.%Ni Cu-3at.%Ni substrate materials. These relevant lead frame materials electronic components. Cu-Ni alloys were contact to galvanic plated Sn. work focused on unexpected hexagonal ζ-(Cu,Ni)10Sn3 phase at 523–623 K, which far below eutectoid decomposition temperature binary ζ-Cu10Sn3 about 855 K. By scanning electron microscopy, energy dispersive X-ray spectroscopy, backscatter diffraction presence ζ confirmed its structural properties analyzed.
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