Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn–Cu–Ni (SCN) lead-free solder joints
作者： Chaoran Yang , Fubin Song , SW Ricky Lee
DOI: 10.1016/J.MICROREL.2013.10.005
关键词: Copper 、 Brittle fracture 、 Brittleness 、 Excessive growth 、 Doping 、 Soldering 、 Materials science 、 Interfacial fracture 、 Metallurgy 、 Intermetallic
摘要: Cu 6 Sn 5 and Cu 3 Sn are common intermetallic compounds (IMCs) found in Sn–Ag–Cu (SAC) lead-free solder joints with OSP pad finish. People typically attributed the brittle failure to …
core.ac.uk
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