Cold plate for cooling electronics
作者： Michael P. Ciaccio
DOI:
关键词: Orifice plate 、 Heat exchanger 、 Thermal 、 Plate fin heat exchanger 、 Electronic component 、 Air cooling 、 Mechanical engineering 、 Electronics 、 Plate heat exchanger 、 Engineering
摘要: A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the by dividing into hypothetical zones, determining needed respective zones adjacent and tailoring heat exchanger layer different structures provide relatively high lower efficiency where needed. coolant flow, jet impingement exchange structure formed alternately stacked orifice plates spacer provides cooling. The only which must accommodating particular arrangement cooled.
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