作者: Gary J. Lutfy
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摘要: An internally cooled semiconductor package including a wafer-like body (diodes 12) with at least two electrical elements, one relatively flat surface (18) of the body. A wall (20, 22) if high and heat conductive material abuts to be in good relation therewith contact same. fluid flow exchanger (10) is on other side exchange along components serves encapsulate semiconductor.