Semiconductor cooling device and stack of semiconductor cooling devices
作者： Takayuki Yamaoka , Satoshi Senoo , Hokichi Yoshioka
DOI:
关键词: Composite number 、 Coolant 、 Plating 、 Stack (abstract data type) 、 Materials science 、 Semiconductor 、 Thermal conductivity 、 Ultimate tensile strength 、 Composite material 、 Electronic engineering 、 Thermal expansion
摘要: To prevent occurrence of distortion in a semiconductor cooling device and to chip from being separated away the case are thermally expanded, includes at least an upper plate, intermediate plate lower has coolant inlet portion, outlet portion flow passage portion. The composite plates constituted by plating copper maintaining thickness not smaller than 0.05 mm on one surface or both surfaces auxiliary made material having tensile strength 1000 N/mm2, heat conductivity 100 W/m·K coefficient thermal expansion larger 6.0 ppm/° C.
lens.org 参考文章(19)
Praveen Medis, Frank Gerner, Srinivas Parimi, Ahmed Shuja, H. Henderson, Silicon mems based two-phase heat transfer device ,(2006)
Takafumi Toshiba Corp. Nakahama, Kenji Toshiba Corp. Kijima, Cooling device for heat-generating elements ,(2002)
Boris Akselband, Charles Gerbutavich, Richard Goldman, Charles Carswell, Contact cooling device ,(2005)
Thomas H. Di Stefano, Peter T. Di Stefano, Cooling apparatus for microelectronic devices ,(2006)
Arthur O. Kunstmann, David J. Johnson, Nicholas J. Krajewski, Memory metal electrical connector ,(1989)
Thomas J. Fagan, Paul G. Kennedy, Robin E. Hamilton, William S. Woodward, Closed loop liquid cooling for semiconductor RF amplifier modules ,(1997)
Randy T. Pike, Richard A. Gassman, Charles M. Newton, Electronic device using evaporative micro-cooling and associated methods ,(2000)
Barrett M. Faneuf, Stephen W. Montgomery, Jason B. Chesser, Modular capillary pumped loop cooling system ,(2002)
Raschid Jose Bezama, Roger Ray Schmidt, John Harold Magerlein, Evan George Colgan, Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages ,(2004)
John Ostop, Gregory A. Arlow, Thomas J. Fagan, Paul G. Kennedy, Robin E. Hamilton, Martin L. Baker, John C. Golombeck, Method of extracting heat from a semiconductor body and forming microchannels therein ,(1998)