作者: Arthur O. Kunstmann , David J. Johnson , Nicholas J. Krajewski
DOI:
关键词:
摘要: A method and apparatus for interconnecting circuit board assemblies using memory metal wires mechanically inserted into through-plated holes. The invention has its application in the interconnection of stacked where kinked are stretched so substantially straight; axially aligned holes boards; released that reform their original shaped within holes, forming an electrical connection between boards. Memory alloys used construction to take advantage pseudoelastic behavior austenitic phase below temperature range.