Chip carrier mounting device

摘要: A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having predetermined pattern of apertures in are positioned preforms joint-forming material such solder. The retains its general configuration after the interconnection or soldering process form resilient joint more capable withstanding stress, strain and fatique. method forming interconnections comprises placing between parallel patterns electrically conductive elements, pads on electronic component circuit board, effecting bonding elements with preforms. may be filled solder composition supported substantially maintain their physical shape when molten, elastomer.