Semiconductor die-attach technique and composition therefor

摘要: A method of attaching semiconductor die to a package substrate and composition for such attach is disclosed, which comprise the combination low high-melting powder with vehicle consisting solvent binder so as form thick-film ink. The ink deposited onto metallized back surface located in contact containing heated temperature approximately 160° C. remove from powders residual binder. Next, fired at within range 200° 430° melt low-melting bonds chip substrate. Then, lid sealed over die-receiving cavity by heating bonded 400° 450° wherein remelts partially dissolves into liquid remelted powder.