Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits
作者： Isao Tsukagoshi , Yasushi Goto , Yutaka Yamaguchi , Atsuo Nakajima
DOI:
关键词:
摘要: A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of curing agent with film, (C) pressure-deformable electroconductive having average particle size larger than that the (B), and if necessary (D) rigid smaller (B). Also, method using for connecting circuits electrically or semiconductor chip to wiring substrate.
lens.org 参考文章(8)
Yoshio Takeda, Heat sensitive type adhesive connector ,(1986)
Carl Edward Hoge, Semiconductor die-attach technique and composition therefor ,(1983)
Yutaka Yamaguchi, Isao Tsukagoshi, Tadamitsu Nakayama, Anisotropic-electroconductive adhesive film ,(1986)
James C. Kyle, Terminal assembly and method of forming terminal assembly ,(1984)
J. Bolger, C. Mooney, Die Attach in Hi-Rel P-Dips: Polyimides or low chloride Epoxies? IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 7, pp. 394- 398 ,(1984) , 10.1109/TCHMT.1984.1136379
Shoichi Kimura, Die-bonding electroconductive paste ,(1984)
II Howard R. Test, Assembly of an electronic device on an insulative substrate ,(1980)
Kenji Fujimura, Kunimasa Kamio, Shigeru Sekiya, Satoru Haraguchi, Koichi Okuno, Koiti Ohasi, Hiroyuki Yamaguchi, Pate conductrice de l'electricite et circuit electronique ayant des composants relies par une pate conductrice ,(1982)